Shenzhen XCF Electronics Co., Ltd (XCF) is a high quality and reliable rigid-flex and flex PCBs factory offering a best value for money solution when costs, flexibility and fast lead times are an issue but quality cannot be compromised. XCF supplies boards of various complexities and materials including Single Layer Flexible PCB, Double Layer Flexible PCB, Multiple Layer Flexible PCB, Rigid-Flex PCB, HDI Flexible PCB. Our products are widely employed in many sectors, such as automotive, white goods, Lighting, Industrial, Medical and Banking. Our ISO compliant facilities ensures we are meeting every industry standard for your product design requirements. We are flexible, customer focus, collaborative and sustainable partners.
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By leveraging our state-of-the-art infrastructure and waste-minimizing LEAN practices, we help companies design, manufacture, assemble and launch their products quickly, affordably and in the most efficient and cost effective manner. To be the world’s best flexible printed circuit board (FPC) supplier.
The full satisfaction of our customers' expectations is our most important ai: from understanding the requests and problems, to the elaboration of the best solutions, as well as the research for innovative materials.
Enable business stakeholders to maximize the return on investment on a win-win platform
Advocate fair and healthy competition and promote technology application
Develop and expand enterprises, give back to society, and promote social harmony
Provide an enterprise platform, through teaching employees, solving doubts, and preaching, so that employees can realize value, change their destiny, and create a better life
Meet customer needs and create value for customers with excellent quality and fast service
Build a stable, high-quality and fast supply chain to achieve a win-win situation
Single and double-sided flexible board design, production and SMT, 4G mobile phone, tablet complete machine supporting in the field of communication.
Laptops, TDR impedance cables, mobile phone cables, three-to-five-layer multi-layer flexible board cables and patches are shipped together.
Mobile phone camera module COB rigid flex pcb board and R&D and production,
Enter mass production after 8 months.
R&D and design of four-layer to twelve-layer flexible and rigid boards,
Enter mass production at the end of the year.
The research and development of HDI multi layer flexible board and four-layer first-class HDI rigid-flex PCB board, Entering mass production in July 2019.
R&D and production of 18-layer rigid flex printed circuit boards and second- and third-class HDI eight-layer rigid-flex PCB board, Mass production starts in August.
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E-EMAIL: xcfeirc-fpc@vip.163.com
Jampzhang@xcfefpc.com
TEL: +86-13560713321
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