Process Capability

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Product design is divided into three levels

High-end products

TDR impedance HDI multi-layer
flexible board More than four
layers of flexible and rigid board

Mid-end products

Multilayer flex board
Four-layer flex-rigid board

Low end product

Single/Double FPC

Production and process capabilities

Twenty to eighteen layers of flex-rigid boards, first to third-order HDI flex-rigid boards, three to twelve layers and more Layer flex board, line width
line spacing is 0.05/0.075mm, various TDR characteristic impedance flex boards and flex-rigid boards

The preferred flex pcb manufacturing platform for 300,000 customers worldwide

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