1. The main content of electroplating production site process management

1) Control the composition of each tank liquid within the process formula specifications. Comply with the prescribed chemical analysis cycle.

2) Maintain the process conditions for electroplating production. Such as temperature, current density, etc.

3) Maintain good electrical contact between the cathode and anode.

4) Strict cathode and anode suspension positions.

5) Keep the plating solution clean and control impurities.

6) Maintain the integrity of the electroplating hanging bracket and good electrical contact with the hooks and hanging teeth.

2. Method of adding electroplating bath solution: The principle of adding materials should be "frequent addition" and "less addition".

2.1 Supplement of solid materials

Some organic solid materials are first dissolved in organic solvents and then slowly added to improve solubilization. If directly added, it often makes the plating solution cloudy. General solid materials can be dissolved in batches using the solution in the plating bath. Take a portion of the electroplating solution and slowly add the material to be added while stirring. Wait for it to settle and add the upper layer of clear solution to the plating tank. Add the undissolved part to the plating solution and stir for dissolution. Repeat the homework in this way until all are added. Without affecting the total volume of the plating solution, deionized water or hot deionized water can also be stirred and dissolved before being added to the plating bath. Some solid materials are prone to forming clumps, which affect the dissolution process. You can first mix a small amount of water into a slurry and gradually dilute it to avoid the formation of clumps.

2.2 Supplement of liquid materials

It can be diluted with deionized water or diluted with plating solution and slowly added with stirring. It is strictly prohibited to add the original solution of additive brightener to the plating bath.

2.3 Timing of supplementary materials

It is best to add materials when the plating is stopped. After being added, it is thoroughly stirred before being put into production. Adding materials in production should be done during the "temporary rest" period after the workpiece is first out of the slot. It can be added at the outlet of the circulation pump at a slow rate, and the medicine will quickly disperse with the impact force of the outlet.

2.4 Possible consequences of improper feeding methods

1) If a brightener is added, it can easily cause differences in the color of the workpiece in this slot.

2) If an undissolved solid material is added, it can easily cause burrs or roughness in the coating.

3) If acid is added to adjust the pH, it will cause uneven pH inside the tank solution and locally cause pinholes.