Double-sided PCB board is a very important type of PCB board in the circuit board market. There are double-sided circuit boards with metal base, Hi Tg heavy copper foil circuit boards, flat and winding double-sided circuit boards, high-frequency PCBs, mixed dielectric base high-frequency double-sided circuit boards, etc. It is suitable for a wide range of high-tech industries such as telecommunications, power supply, computers, industrial control, digital products, scientific and educational instruments, medical equipment, automobiles, aerospace defense, etc.

Double-sided printed boards are usually made of epoxy glass cloth copper foil. It is mainly used for communication electronics with high performance requirements

Equipment, advanced instruments and electronic computers, etc.

The production process of double-sided boards is generally divided into several types: process wire method, hole blocking method, masking method, and graphic electroplating etching method. The process flow of graphic electroplating etching method is shown in the figure.

The most commonly used method for double-sided PCB sampling is the process. At the same time, rosin process, OSP process, gold plating process, gold deposition, and silver plating processes are also applicable in double-sided boards.

Tin spraying process: Good appearance, silver white solder pad, easy to solder, easy to solder, and low price.

Tin metal process: Stable quality, usually used in the presence of bonding ICs.