Line layer

The line layer (generally uses electrolytic copper foil) to form a printing circuit after etching is used to achieve the assembly and connection of the device. Compared with the traditional FR-4, the same thickness and the same wire width are used, and the aluminum substrate can carry higher current.

Insulation

The insulation layer is the core technology of the aluminum substrate, which mainly plays the function of bonding, insulation and heat conduction. The insulation layer of the aluminum substrate is the largest heating barrier in the power module structure. The better the thermal conduction performance of the insulation layer, the more conducive to the spread of the heat generated during the runtime of the device, the more conducive to reducing the operating temperature of the device, thereby reducing the power load of the module, reducing volume, extending life, and increasing power output and other purposes. Essence

Metal grassroots

What kind of metal insulation metal substrates need to depend on the comprehensive consideration of the thermal expansion coefficients of the metal substrate, thermal conductivity, strength, hardness, weight, weight, surface state and cost.

Under normal circumstances, from the conditions such as cost and technical performance, aluminum plates are ideal choices. The selected aluminum plates are 6061, 5052, 1060, etc. If there are higher thermal conductivity, mechanical performance, electrical performance, and other special performance requirements, copper plates, stainless steel plates, iron plates and silicon steel plates can also be used.