As soon as BGA emerged, it became the best choice for high-density, high-performance, multifunctional, and high I/O pin packaging of VLSI chips such as CPUs and north-south bridges. Its characteristics include:

Although the number of I/O pins has increased, the pin spacing is much greater than that of QFP, thereby improving the assembly yield;

Although its power consumption increases, BGA can be soldered using the controllable collapse chip method, abbreviated as C4 soldering, which can improve its electric heating performance;

3. The thickness is reduced by more than 1/2 compared to QFP, and the weight is reduced by more than 3/4;

4. The parasitic parameters are reduced, the signal transmission delay is small, and the usage frequency is greatly increased;

5. Assembly can be carried out using coplanar welding, with high reliability;

6. BGA packaging is still the same as QFP and PGA, occupying too much substrate area;

Intel Corporation adopts ceramic pin grid array packaging CPGA and ceramic Ball grid array packaging CBGA for CPU chips with high integration (more than 3 million transistors in a single chip) and high power consumption, such as Pentium, Pentium Pro and Pentium II, and installs micro exhaust fan on the shell to dissipate heat, so as to achieve stable and reliable operation of the circuit.