There are predictions that with the arrival of the digital product peak season and the development of Apple's new generation mobile phones, the revenue of soft printed circuit board manufacturers has significantly increased in recent months. The pressure on product price reduction has slowed down, and the prices of the FPC industry are gradually recovering. Flexible copper clad laminate (FPC) with flexible function and polyimide as the base material is used more and more widely due to its special function, and has reached a new level in the circuit board industry.

FPC flexible printed circuit is a highly reliable and excellent flexible printed circuit made of polyimide or polyester film. Since the implementation of industrial production, epoxy flexible printed circuit boards have gone through more than 30 years of development. Since the 1970s, it has entered into a truly industrialized production. Until the late 1980s, due to the emergence and application of a new class of polyimide film materials, The use of flexible printed circuit boards has led to the emergence of adhesive free FPCs (commonly referred to as "two-layer FPCs") . In the 1990s, the world developed photosensitive covering films corresponding to high-density circuits, which led to significant changes in the design of FPCs. Due to the opening up of new application fields, the concept of its product form has undergone significant changes, including expanding it to a larger range of substrates for TAB and COB. The high-density FPC that emerged in the latter half of the 1990s began to enter large-scale industrial production, and its circuit graphics rapidly developed towards a finer level. The market demand for high-density FPC was also rapidly increasing.

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