1. Gilded plate

The cost of the gold-plated PCB process is the highest among all PCB boards, but currently the most stable and suitable for lead-free PCB boards. Especially in some electronic products with high unit prices or requiring high reliability, it is recommended to use this PCB board as the substrate.

2. OSP board

The OSP process has the lowest cost and is easy to operate, but its popularity is still poor due to the need for assembly plants to modify equipment and process conditions, as well as poor repeatability. Using this type of PCB board, after high temperature heating, the protective film pre coated on the PAD will inevitably be damaged, leading to a decrease in solderability, especially when the PCB board undergoes secondary reflow. Therefore, if another DIP process is needed in the process, At this point, the DIP end will face welding challenges.

3. Silver plate

Although "silver" itself has strong mobility, leading to leakage, the current "immersion silver" is not simply metallic silver in the past, but "organic silver" co plated with organic matter. Therefore, it can meet the needs of future lead-free processes, and its solderability life is longer than that of OSP boards.

4. Gold plate

The biggest problem with this type of PCB substrate is the issue of "BlackPad", so many large manufacturers do not agree to use it in lead-free processes, but most domestic manufacturers use this process.

5. Tin plate

This type of PCB substrate is prone to contamination and scratches, and the process (FLUX) can cause oxidation and discoloration. Most domestic manufacturers do not use this process, resulting in relatively high costs.

6. Spray tin plate

Due to its low cost, good solderability, reliability, and strongest compatibility, this type of solder spray with good soldering characteristics cannot be used in lead-free processes due to its presence of lead.