5G communication has an increasing impact on people's lives, and newly developed mobile phones will gradually enter the 5G era. So let's take a look at the challenges that 5G communication has brought to the PCB industry together

Material requirements: A very clear direction for 5G PCB is high-frequency and high-speed materials and board manufacturing. In terms of high-frequency materials, it is evident that material manufacturers in traditional high-speed fields such as Lianmao and Panasonic have begun to lay out high-frequency plates and launched a series of new materials. This will break the current situation where Rogers dominates in the field of high-frequency panels. After benign competition, the performance, convenience, and availability of materials will be enhanced. So, the localization of high-frequency materials is an inevitable trend.

Requirements for quality monitoring: Due to the improvement of 5G signal rate, the deviation of board making has a greater impact on signal performance, which requires stricter control of production deviation of board making. However, the current mainstream board making processes and equipment updates are not significant, which will become a bottleneck for future technological development. It is crucial for PCB manufacturing enterprises to break through the situation.

Requirements for process technology: The functional improvement of 5G related application products will increase the demand for high-density PCBs, and HDI will also become an important technical field. Multi stage HDI products and even products that are interconnected in any order will be promoted, and new technologies such as buried resistors and buried capacities will be increasingly applied.

The uniformity of copper thickness, degree of line width, interlayer alignment, interlayer medium thickness, control accuracy of back drilling depth, and plasma anti drilling ability of PCB are all worthy of in-depth research.

Requirements for PCB design: The selection of the board should meet the requirements of high frequency and high speed, and impedance matching, stacking planning, wiring spacing/holes, etc. should meet the requirements of signal integrity. Specifically, it can be started from six aspects: loss, embedding, high-frequency phase/amplitude, mixed pressure, heat dissipation, and PIM.