1: Material cutting

Copper foil and accessories

2: Drilling

Drill copper foil and a few accessories that require drilling

3: Sinking copper plating

Copper plating on drilled holes, including copper for measuring holes in physical chambers

4: Line

Exposure development etching (impedance testing after etching)

5: Fit

Covering film PI shielding film

6: Compression curing

Combination of auxiliary materials and copper foil

7: Resistance welding

Protection circuit

8: Punching

Opening positioning holes

9: Sinking gold

Measurement of nickel and gold thickness in the physical room

10: Silk screen printing

Printing character logos and the like

11: Testing

Electrical or flying needle testing to open a short circuit

12: Assembly

Apply some reinforcement materials such as thermosetting adhesive 3M, steel sheet FR4, etc

13: Punching cutting

Depending on the shape, some need to be punched into a single PCS, while others only need to be punched out of the outer frame, etc

14: FQC FQA Packaging

Packaging Outgoing

15: SMT

Surface mounting technology, commonly known as component mounting, involves installing components such as ICs on circuit boards

16: IQC FQA

17: Packaging and shipping