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What is the process flow of FPC soft circuit board

Time:2023-08-16Views:



1. Ordinary double-sided process:




Material cutting → drilling → PTH → electroplating → pre-treatment → dry film application → alignment → exposure → development → graphic electroplating → film removal → pre-treatment → dry film application → alignment exposure → development → etching → film removal → surface treatment → covering film application → pressing → curing → nickel deposition → printing characters → cutting → electrical testing → punching → final inspection → packaging → shipment




2. Simple single sided process:




Cutting → Drilling → Applying Dry Film → Alignment → Exposure → Developing → Etching → Stripping → Surface Treatment → Applying Covering Film → Pressing → Curing → Surface Treatment → Nickel Gold Deposition → Printing Characters → Cutting → Electrical Testing → Punching → Final Inspection → Packaging → Shipping


Advantages Introduction


1. The advantages of a large soft circuit board are its small size, light weight, increased functionality, and reduced cost




2. Soft circuit boards have a high degree of flexibility, allowing for three-dimensional wiring, changing shape according to space limitations, and folding them does not affect signal function




3. Soft circuit boards are resistant to high, low, and flame. And it has properties such as chemical stability and stability




4. Soft circuit boards are beneficial for the design of related products, reducing assembly errors and improving the service life of related products


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