Insulation resistance of double-layer FPC:>=500M Ω.

Thermal insulation resistance: a. At room temperature:>=500M Ω. B. After wet heat treatment:>=100M Ω.

Solderability: 260 ± 5 ℃, 3-5 seconds, 100% wetting.

Thermal shock test: 260 ± 5 ℃ * 10s * 3 times, Sn infiltration. No layering, no bubbles.

There are many applications of FPC software boards in smartphones, including batteries, screens, fingerprint modules, and cameras. The basic testing standards for FPC software boards are:

1. Appearance of substrate film surface and covering layer;

2. Deviation between the connecting disc and the covering layer, leakage of the adhesive and the covering layer, and discoloration of the conductor under the covering layer;

3. Whether the temperature and humidity resistance, voltage resistance, bending resistance, and welding resistance meet the requirements;

4. Poor electroplating bonding, coating leakage, etc.