To produce a high-quality FPC flexible circuit board, there must be a complete and reasonable production process, from pre production processing to final shipment, every procedure must be strictly executed. In the production process, in order to prevent too many short circuits from causing low yield or reducing process issues such as drilling, rolling, and cutting, FPC board scrap and replenishment issues are caused, and to evaluate how to select materials to achieve the best effect for customer use of flexible circuit boards

The production method of printed circuit board gold fingers relates to the field of production technology of printed circuit boards, and can solve the problem of residual electroplating leads of printed circuit board gold fingers. The production method of a gold finger on a printed circuit board in this technology includes the steps of forming a gold finger electroplating lead and a gold finger area on the printed circuit board in one go, wherein the width of the adjacent part between the electroplating lead and the gold finger area is equal to the width of the gold finger area; Coating the covering material to form a gold finger electroplating reserve area, and electroplating the gold finger electroplating reserve area to form a gold finger; Remove the cover and etch to obtain a gold finger without electroplating leads. This technology is suitable for the production of lead-free gold fingers on printed circuit boards.