High frequency PCB circuit design is a very complex design process, and its wiring is crucial for the entire design! So, what are the wiring methods for high-frequency PCB circuits?

1. Multilayer board wiring

In the PCB layout stage, choose a reasonable number of layers of printed circuit board size, fully utilize the middle layer to set shielding, better achieve nearby grounding, effectively reduce parasitic inductance and shorten signal transmission length, while also significantly reducing signal cross interference.

2. The less bent the leads between electronic device pins, the better

It is best to use a full straight line as the lead wire, which requires a turning point. A 45 degree broken line or arc turning point can be used to meet this requirement, but it can reduce the external emission and mutual coupling of high-frequency signals.

3. The shorter the lead between device pins, the better

The radiation intensity of a signal is directly proportional to the length of the signal line, and the longer the high-frequency signal lead, the easier it is to couple to components close to it.

4. The less alternating the lead layers between device pins, the better

The fewer vias (Via) used during component connection, the better. Reducing the number of vias can significantly improve speed and reduce the possibility of data errors.

5. Pay attention to the "crosstalk" caused by parallel routing of signal lines in close proximity

Due to the transmission of high-frequency signals along the transmission line in the form of electromagnetic waves, the signal line acts as an antenna, and the energy of the electromagnetic field is emitted around the transmission line. The unexpected noise signal generated by the mutual coupling of the electromagnetic fields between signals is called crosstalk.

6. Add high-frequency decoupling capacitor to the power pin

Add a high-frequency decoupling capacitor to the power pin of each integrated circuit block, which can effectively suppress high-frequency harmonic interference on the power pin.

7. Isolation between high-frequency digital signal ground wire and analog signal ground wire

Usually, the ground wires of high-frequency digital signals and analog signals need to be isolated, which can be achieved through single point interconnection at appropriate locations or through high-frequency choke magnetic bead interconnection.