Many special components are often used in PCB layout, and if the layout is not handled properly, it will directly affect the performance and quality of the PCB circuit board. So, what are the layout requirements for special components on PCB circuit boards?

1. Layout requirements for crimping devices

(1) There should be no components greater than 3mm around the crimping device surface, and no welding components should be present around 1.5mm; There must be no components within a distance of 2.5mm from the center of the pin hole of the crimping device on the opposite side of the crimping device.

(2) There should be no components within 1mm around the crimping device.

2. Layout requirements for thermal sensitive devices

(1) Thermal sensitive devices (such as electrolytic capacitors, crystal oscillators, etc.) should be kept away from high thermal devices as much as possible.

(2) The thermal sensitive device should be tightly attached to the tested component and away from the high-temperature area to avoid the influence of other thermal equivalent components.

(3) Place the heating and heat-resistant devices close to the air outlet or at the top, and try to stagger them from other heating devices and thermosensitive devices in the direction of air rise.

3. Layout requirements for devices with polarity

(1) THD devices with polarity or directionality have consistent orientation and neat arrangement in layout.

(2) SMCs with polarity should have the same direction on the board as much as possible; Devices of the same type are arranged neatly and aesthetically pleasing.