1、 Raw materials

The raw materials for PCB sinking gold plates mainly include substrates, electroplating solutions, and chemicals. Among them, the substrate is the main component of the PCB gold plate, and the material and quality of the substrate directly affect the quality of the PCB gold plate. If the material of the substrate is impure or of poor quality, it is easy to cause carbon elements in the PCB gold plate to exceed the standard.

2、 Production process

The production process of PCB sinking plates includes multiple processes such as chemical gold plating, electroplated gold plating, and nickel plating. In these links, if the operation is improper or the process is not perfect, it can lead to excessive carbon content in PCB gold plating plates. For example, in the chemical gold plating process, if the temperature, pH value, concentration and other parameters of the plating solution are not suitable, it can lead to excessive carbon content.

3、 Equipment and facilities

The production of PCB gold plates requires the use of various equipment and facilities, such as electroplating tanks, chemical gold plating tanks, cleaning tanks, etc. If the materials of these equipment and facilities are not suitable or of poor quality, it is easy to cause carbon elements in PCB gold plates to exceed the standard. In addition, the maintenance and upkeep of equipment and facilities are also very important. If not cleaned and maintained in a timely manner, it will lead to an increase in impurities and pollutants inside the equipment and facilities, leading to excessive carbon elements in PCB gold plates.

4、 Environmental factors

The production environment of PCB sinking gold plates can also have an impact on the carbon content. For example, factors such as air quality, temperature, and humidity in the production workshop can all affect the quality of PCB sinking plates. If the air in the production workshop contains a large amount of dust, pollutants, etc., it will lead to excessive carbon elements in PCB gold plates.