High frequency board refers to a special circuit board with high electromagnetic frequency. Generally speaking, high frequency can be defined as a frequency above 1GHz. The application range of high-frequency circuit boards is very wide, and there are strict requirements in design and manufacturing. So, what are the specific requirements for the production of high-frequency PCB circuit boards?

1. The corner of the transmission line should adopt a 45 ° angle to reduce return loss;

2. The use of high-performance dielectric circuit boards with strictly controlled dielectric constant values according to the number of layers is conducive to effective simulation calculation of the electromagnetic field between insulation materials and adjacent wiring.

3. Produce according to the design specifications for high-precision etching of circuit boards. The total error of the specified line width is+/-0.0007 inches, and overall management of the wiring (wire) geometry and coating surface is crucial for addressing skin effect issues related to microwave frequency and achieving these specifications.

4. In high-frequency environments, it is best to use surface mounted SMD components and avoid using components with leads.

5. For signal vias, it is necessary to avoid using through hole machining (PTH) process on sensitive boards, as this process can cause lead inductance to be generated at the vias; Buried blind holes or back drills should be used.

6. Provide a rich grounding layer to prevent the impact of three-dimensional electromagnetic fields on the circuit board.

7. To choose non electrolytic nickel plating or immersion gold plating process, do not use HASL method for electroplating; This type of electroplating can provide better skin effect for high-frequency currents and help reduce environmental pollution.

The solder mask layer can prevent the flow of solder paste, and generally uses a welding dam as the solder mask layer.