When it comes to the method of making multi-layer circuit boards, it usually involves first creating the inner layer graphics, then using printing and etching to create a single or double-sided substrate, which is included in the designated interlayer, and then heated, pressurized, and bonded. In fact, these basic production methods have not changed much from the construction methods dating back to the 1960s, but as the materials and process technology become more mature, the characteristics attached to the multi-layer board have also become more diverse.

Compared to other forms of circuit boards, multi-layer circuit boards can increase the number of wiring layers, thereby increasing design flexibility; Due to the high assembly density, the connection between components is reduced, thus improving reliability. In addition, the device can also be equipped with circuit and magnetic shielding layers, as well as metal core heat dissipation layers to meet special functional needs such as shielding and heat dissipation. Of course, multi-layer circuit boards are not entirely without drawbacks. High cost, long cycle, and high reliability testing methods are required, which will require significant investment in terms of cost.

In summary, with the continuous development of electronic technology, especially the widespread and in-depth application of large-scale and ultra large scale integrated circuits, multi-layer circuit boards under the FPC series are rapidly developing towards high-density, high-precision, and high-level digitization, and technologies such as fine lines, small aperture penetration, blind hole burial, and high plate thickness to aperture ratio have emerged to meet market needs.