1、 FPC soft board reinforcement main process

PCB production process flow: cutting (copper foil protective film reinforcement PSA) → drilling (copper foil protective film reinforcement PSA) → Black hole or PTH → Apply dry film → Film alignment → Exposure → Developing → Electroplating copper → Removing dry film → Chemical cleaning → Apply dry film → Film alignment → Exposure → Developing → Etching → Removing dry film → Grinding and brushing → Apply upper/lower protective film → Lamination → Reinforcement → Lamination → Punching → Printing text → Baking → Surface treatment → PSA pasting → Splitting → Punching leads → Electrical inspection → Punching appearance → FQC (full inspection) → OQC → Packaging → Shipping

2、 Strengthening and fitting

1. Hot pressing reinforcement: At a certain temperature, the heat hardening adhesive of the reinforcement film begins to melt, causing the reinforcement film to adhere to the product, positioning the reinforcement.

2. Pressure sensing reinforcement: Without heating, reinforcement can be adhered to the product.

3、 Reinforcement and compression

1. Hot pressing reinforcement: Use high temperature to melt the heat hardening adhesive of the reinforcement film, and use appropriate pressure or vacuum to make the reinforcement film tightly adhere to the flexible circuit board.

2. Pressure sensing reinforcement of flexible circuit boards: no heating is required, and the products are pressed with a cold press