1. Design and Planning: Based on the functions and requirements of the sensor, the manufacturer designs and plans to determine the required type and size of the circuit board.

2. Material selection: According to design requirements, select suitable circuit board materials, usually using FR-4 glass fiber composite material.

3. Printed Circuit Board (PCB) Manufacturing: Using printing technology to create circuit patterns on a substrate. This process involves processing the copper foil layer into the desired circuit shape, covering the surface of the circuit board with photosensitive adhesive, and using ultraviolet radiation to define the circuit pattern.

4. Chemical etching: By chemical etching, unnecessary copper foil layers are peeled off, leaving only the required wiring. This ensures that the circuit will not short-circuit.

5. Punching: Drill holes in the locations where components need to be installed to facilitate the installation of electronic components.

6. Assembly of components: Install electronic components (such as resistors, capacitors, integrated circuits, etc.) accurately and reliably on the circuit board according to design specifications and requirements.

7. Welding: Use a welding table or other welding equipment to weld components onto the circuit board. This may include surface mount technology (SMT) or plug-in mount technology (THT).

8. Testing and quality control: Conduct testing on manufactured circuit boards to ensure their normal operation and stable quality. These tests can include electrical testing, functional testing, and reliability testing.