1. Cutting: Conduct preliminary cutting of the substrate according to the required size, ensuring that the size is correct and the surface is free from creases, stains, etc.

2. CNC drilling: high-speed drilling of the plate according to the size and shape of the hole diameter or pattern in the design drawings.

3. Copper plating: Using the principle of precipitation and precipitation of chemical copper, a thin copper layer is coated on the surface of the substrate and copper hole surface, and its thickness is checked. The copper plating is required to be uniform and smooth. And carry out appropriate chemical flushing to remove the surface easily.

4. Apply dry film.

5. Two sided exposure: Place the semi-finished FPC hollow board under certain lighting conditions to detect any pinhole breakage or other conditions.

6. Development: Display the image of the negative film.

7. Etching: Remove oxides and impurities from the surface of the hollow board, and enhance the adhesion ability of copper to the surface.

8. Remove the film and perform chemical cleaning: Remove the excess part of the applied dry film.

9. Apply protective film: The protective layer on the surface of the FPC hollow board.

10. Lamination: Make the applied film more firmly adhere to the surface of the FPC hollow board.