FPC covering film is a commonly used functional film in the PCB industry. Its main function is to protect copper foil from oxidation, as well as to cover the subsequent surface treatment and resist soldering in the SMT process.

What are the methods of window opening process for FPC soft board covering film

The meaning of opening a window on the FPC covering film is to open a hole on the covering film in the exposed copper foil area, according to the shape of the solder pad in the design data, to expose the FPC circuit or finger circuit or solder pad, and then perform surface treatment to achieve the function of connection and attachment.

Introduction to the window opening process of FPC soft board covering film:

There are two common ways to open windows for FPC covering film: one is to open a mold for punching, and stamping is the preferred method. Although the cost of opening a mold for the first time is high, a set of molds is very suitable for mass production.

Another type is UV laser cutting, which is suitable for samples and small batches without the need for mold opening.