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The main laminating materials for FPC lamination are

Time:2023-11-15Views:



 

1. Release membrane:

 

 

 

With strict quality control and post curing, it has the characteristics of high temperature resistance, good release effect, and pollution-free pressing process. The release film can be supplied in rolls and customized sheet sizes to meet customer requirements of different specifications, providing the moderate and externally applied hydraulic pressure required to drive the laminated components to achieve dense lamination. It can eliminate air from entering the bottom of the protective layer and between circuit boards.

 

 

 

2. TPX release film: Its function is similar to that of the aforementioned release film, except that some FPC circuit board manufacturers have strict requirements. TPX release film is a high-performance molecular material that can be used as a high-performance release film for various purposes. With its excellent release and heat resistance, it is used as a circuit board and cutting-edge material mainly for flexible printed substrates (FPCs). The demolding film is used in various occasions, and there are single-layer and multi-layer products available, which can be selected according to the purpose.

 

 

 

3. Steel plate

 

 

 

4. Silicone pad/Silicone pad: divided into red and green rubber pads, it is a synthetic elastic buffer pad made of silicone linked polymer, with a glass fiber substrate in the middle layer, greatly improving the strength and frequency of use of the red silicone pad. It has characteristics such as buffering, release, and thermal balance, and is mainly used in hot pressing situations with high buffering needs, such as circuit boards (FPCs, PCBs, soft hard composite boards, etc.), solar energy, aerospace, power locomotives, mold pressing, busbar pressing, and other fields.

 

 

 

5. Repeated use of cushioning pads for pressing: Developed and produced for the ultra-high temperature press currently used in the PCB industry. When the pressing temperature of the circuit board exceeds 260 , ordinary auxiliary materials such as kraft paper and cushioning pads can no longer meet the high temperature pressing needs, and higher temperature resistant fiber materials must be used. At present, this RCX-K25 cushion has excellent temperature resistance and can meet the requirements of ultra-high temperature pressing.


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