Adhesive electrolysis refers to the three-layer flexible copper clad plate (3L-FCCL), which is composed of three different materials: electrolytic copper foil, thin film, and adhesive. It is also known as the adhesive electrolysis substrate. Simply put, it means coating PI film with glue and then bonding it with electrolytic copper foil.

There are two methods for non adhesive electrolysis. One is to use PI film as the carrier and dip electrolytic copper foil on its surface. The other method is to use electrolytic copper foil as the carrier, coat liquid PI on the surface of electrolytic copper foil, and then cure it.

The manufacturing methods of copper foil substrates with and without adhesive electrolysis are different, so the material characteristics of the two types of substrates are also different.