One, circuit board factory tin surface quality defects

So what are the factors that cause the bad tin surface of the tin surface? According to the analysis of the editor, there are the following points

1. The operation is not in accordance with the operating specifications when shipping

The circuit industry has extremely strict requirements on the workshop environment and the standard operation of employees, especially the chemical reaction environment is required in the circuit board production process, so the infiltration of impurities is not allowed. After the board spraying process is completed, the subsequent one All series require employees to wear anti-static gloves to operate, because finger sweat or stains directly contact the surface, which will cause surface oxidation. If it causes defects, it is extremely difficult to find, and it is irregular, and it is difficult to be exposed in testing and tinning experiments.

2. The tin furnace for spraying tin is not cleaned on time

Timely maintenance of the tin furnace is very important, because tin spraying is a vertical cycle process, and the circuit board surface will be under strong pressure. For those boards whose solder mask is not completely dry and the characters are not firm, there will be impact and lead to fall off and deposit in the furnace. , After high temperature evaporation, if it is not cleaned for too long, it will cause surface adhesion.

3. The source of tin used in incoming materials

 For material procurement, some circuit board factories blindly pursue cost reduction. When using tin-sprayed raw tin, tin is recycled in the procurement industry, or sources with unstable content. Generally, circuit board factories with extremely low unit prices may have such a risk probability. , it is recommended that you choose suppliers carefully.