Let me talk to you about the difference between PCB circuit board gold plating and gold plating. Gold plating and gold plating are commonly used processes in PCB circuit boards, and many engineers are unable to correctly distinguish the differences between the two. Some engineers even believe that there is no difference between the two, which is a very wrong viewpoint and needs to be corrected in a timely manner.

So what kind of impact will these two "gold plates" have on circuit boards? Below, I will explain to you in detail and thoroughly help you clarify the concepts.

So everyone chooses gold plating, and what is gold plating? When we talk about whole board gold plating, we generally refer to "electroplated gold", "electroplated nickel gold plate", "electrolytic gold", "electroplated gold", and "electroplated nickel gold plate". There is a distinction between soft gold and hard gold (usually hard gold is used for gold fingers). The principle is to dissolve nickel and gold (commonly known as gold salt) in chemical water, immerse the circuit board in an electroplating cylinder, and connect the current to generate a nickel gold coating on the copper foil surface of the circuit board, Electroplated nickel gold is widely used in electronic products due to its high hardness, wear resistance, and low oxidation resistance.

What is sinking gold again? Gold deposition is a method of generating a layer of coating through chemical oxidation-reduction reactions, which is generally thicker. It is a type of chemical nickel gold deposition method that can achieve a thicker gold layer.