1. Due to the different crystal structures formed by gold deposition and gold plating, gold deposition will appear more yellow than gold plating, resulting in better customer satisfaction.

2. Due to the different crystal structures formed by sinking gold and plating gold, sinking gold is easier to weld than plating gold, and will not cause welding defects, leading to customer complaints.

3. Due to the fact that only nickel gold is present on the solder pad of the sinking gold plate, the signal transmission in the skin effect is in the copper layer and will not affect the signal.

4. Due to the denser crystal structure of deposited gold compared to gold plating, it is less prone to oxidation.

5. Due to the fact that only nickel gold is present on the solder pad of the sinking gold plate, it will not produce gold wire and cause slight shortening.

6. Due to the fact that only nickel gold is present on the solder pads of the sinking gold plate, the bonding between the solder mask and the copper layer on the circuit is stronger.

7. The engineering compensation will not affect the spacing.

8. Due to the different crystal structures formed by sinking gold and plating gold, the stress on the sinking gold plate is easier to control, which is more conducive to the processing of products with bonding. At the same time, it is precisely because sinking gold is softer than plating gold, that sinking gold plates are not wear-resistant when making gold fingers.