SMT process flow refers to a series of process flows that are processed on the basis of PCB (printed circuit board). SMT, also known as Surface Mounted Technology, is a circuit assembly technique that installs surface mounted components (SMC/SMD) without pins or short leads on the surface of printed circuit boards (PCBs) or other substrates, and assembles them by reflow soldering or immersion soldering. The SMT process flow includes two types: single-sided mixing and double-sided mixing. The single-sided mixed packaging process includes steps such as incoming material inspection, A-side screen printing solder paste (red glue) of PCB, SMT, A-side reflow (curing), cleaning, insertion, peak, cleaning, testing, and repair. The double-sided mixed packaging process includes incoming material inspection, B-side screen printing solder paste (red glue) of PCB, SMT, B-side reflow (curing), cleaning, flipping, A-side screen printing solder paste (red glue), SMT, B-side reflow (curing) or (DIP+peak), cleaning, testing, repair and other steps. The SMT process equipment mainly includes solder paste printing machines, mounting machines, templates (steel mesh), etc. The solder paste printing machine is located at the forefront of the SMT production line, used to print solder paste or SMT adhesive. It correctly leaks solder paste or SMT adhesive onto the solder pads or corresponding positions of the printed circuit board, preparing for the installation of components. The SMT mounting machine, also known as the SMT mounting machine, is located behind the printing machine in the SMT production line. Its function is to remove surface mounted components from the packaging and accurately install them into the fixed position of the printed circuit board. The template (steel mesh) is determined whether to process the template based on the designed PCB. The advantages of SMT technology include high assembly density, small size and light weight of electronic products. Generally, after using SMT, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced by 60% to 80%. The SMT process has an absolute advantage in the field of electronic assembly technology, and its density, high-speed, and standardized characteristics make it have a wide range of application prospects in the field of circuit assembly technology.