First, the line

1. Minimum line width: 6mil (0.153mm). That is to say, if the line width is less than 6mil, it will not be produced, (the minimum line width distance of the inner layer of the multi-layer board is 8MIL) If the design conditions permit, the larger the design, the better the line width, the better the factory production, the higher the yield, the general design routine is about 10mil, this point is very important, the design must be considered.

2. Minimum line distance: 6mil (0.153mm).. The minimum line distance, that is, the line to the line, the distance from the line to the pad is not less than 6mil from the production point of view, the bigger the better, the general practice in 10mil, of course, the design conditions, the bigger the better this point is very important, the design must be considered.

3.Line to contour line spacing 0.508mm(20mil)

Two, via holes (commonly known as conductive holes)

1. Minimum aperture :0.3mm(12mil)

2. The minimum through hole (VIA) aperture is not less than 0.3mm(12mil), the single side of the pad can not be less than 6mil(0.153mm), preferably greater than 8mil(0.2mm) is not limited, this point is very important, the design must be considered.

3. Through hole (VIA) hole to hole spacing (hole edge to hole edge) can not be less than 6mil, preferably greater than 8mil. This is very important and must be considered in the design.