The production process of FPC patch mainly includes the following key steps:

1. Raw material preparation:

-Prepare the required FPC substrate, electronic components, solder paste, and other materials.

2. Silk screen solder paste:

-Using screen printing technology, solder paste is printed on FPC to prepare for subsequent mounting.

3. Surface mount technology (SMT):

-By using an automated surface mount machine, electronic components are accurately mounted onto the solder pads on the FPC.

4. Reflow soldering:

-Pass the FPC with components attached through a reflow oven to melt and solidify the solder paste, thereby firmly soldering the components onto the FPC.

5. Cleaning:

-Use specialized cleaning agents to remove residual solder paste and flux on the surface of FPC, ensuring product cleanliness.

6. Inspection:

-Inspect every solder joint and component on the FPC through optical testing, electrical testing, and other methods to ensure product quality.

7. Packaging and delivery:

-Package qualified products and deliver them to customers.

Throughout the entire production process, every step requires strict quality control to ensure the quality and reliability of the final product.