The production process of FPC (Flexible Printed Circuit Board) is quite complex, covering multiple stages from design to finished product. The following are the main steps of the FPC production process:

1. Design and drafting:

-Based on customer requirements, conduct circuit design and layout planning.

-Create detailed manufacturing drawings to clarify the layout and connection relationships of each layer of circuits.

2. Substrate preparation:

-Choose a suitable substrate, such as polyimide (PI) or polyester (PET), and cut and clean it.

3. Graphic transfer:

-Using photolithography technology to transfer circuit patterns onto substrates.

-Perform exposure, development, and other processes to form circuit patterns.

4. Etching and Electroplating:

-By using chemical etching method, the copper foil of non circuit parts is removed to form a preliminary circuit pattern.

-Electroplating is carried out to increase the thickness of circuit conductors and improve conductivity.

5. Cover film bonding:

-Attach a protective film (Coverlay) to the circuit board to protect the circuit from external environmental influences.

-Perform hot or cold pressing to ensure a tight bond between the cover film and the substrate.

6. Drilling and Testing:

-According to the design requirements, drill holes on the circuit board for the installation and connection of components.

-Conduct electrical testing to ensure the connectivity and insulation performance of the circuit.

7. Cutting and assembly:

-Use laser cutting or mechanical cutting methods to divide a large circuit board into individual FPCs.

-Assemble FPC and mount various electronic components onto the circuit board.

8. Quality inspection and packaging:

-Strictly inspect the quality of finished products to ensure that every FPC meets customer requirements.

-Packaging qualified products to prevent damage during transportation.