The main materials of FPC (Flexible Printed Circuit Board) include substrate, conductor material, cover film, and adhesive. Here is a detailed introduction to these materials:

1. Substrate:

-Polyimide (PI): With excellent high temperature resistance and mechanical strength, it is the most commonly used substrate in FPC.

-Polyester (PET): Low cost, suitable for medium and low temperature environments, but its high temperature resistance is not as good as polyimide.

2. Conductor material:

-Copper foil: As the main conductor material of circuits, it has good conductivity and ductility.

-Silver paste: In certain special occasions, silver paste is used as a conductor material to improve conductivity and oxidation resistance.

3. Cover film:

-Polyimide (PI): It has excellent high temperature resistance and chemical stability, and is suitable for electronic products working in high temperature environments.

-Polyester (PET): Low cost, suitable for medium and low temperature environments, but its high temperature resistance is not as good as polyimide.

4. Adhesive:

-Acrylic ester: has good adhesive properties and transparency, suitable for applications that require transparency.