FPC (Flexible Printed Circuit), also known as Flexible Printed Circuit Board, is a type of circuit board made from flexible substrates, characterized by its thinness, bendability, and high integration. FPC is widely used in fields such as mobile phones, computers, automotive electronics, etc., especially in applications that require frequent bending or three-dimensional spatial layout, it performs well.

Manufacturing process:

1. Design and drafting: Based on customer requirements, design circuit diagrams and generate Gerber files.

2. Substrate preparation: Choose a suitable flexible substrate, such as polyimide (PI) or polyester film (PET).

3. Coating photosensitive film: Apply a layer of photosensitive film on the substrate for subsequent exposure and development processes.

4. Exposure and development: Using ultraviolet exposure, transfer the circuit pattern onto a photosensitive film through a mask, and then perform development processing.

5. Etching: By chemical etching, the uncovered part of the photosensitive film is etched away to form a circuit pattern.

6. Coating: Coating the surface of a circuit with a layer of metal (such as copper) to improve conductivity and corrosion resistance.

7. Compression: Press multiple layers of FPC together to form a multi-layer circuit board.

8. Cutting and testing: Cut to the final size as required and conduct electrical performance testing.

Throughout the manufacturing process, exposure and etching techniques are at the core. By precisely controlling the exposure time and etching solution concentration, fine circuit patterns can be formed. The plating process improves the conductivity and durability of the circuit. The entire process requires strict quality control to ensure the reliability and consistency of the product.