When designing a PCB, we usually rely on previous experience and tips that we would normally find online. Every PCB design can be optimized for a specific appli...
Detail +07-17
1. PBGA (Plastic BGA) substrate: Generally a multi-layer board composed of 2-4 layers of organic materials. In the Intel series of CPUs, Pentium II, III, and IV...
07-17
As soon as BGA emerged, it became the best choice for high-density, high-performance, multifunctional, and high I/O pin packaging of VLSI chips such as CPUs and...
07-17
The memory packaged with BGA technology can increase the memory capacity by two to three times without changing its volume. Compared with TSOP, BGA has smaller ...
07-13
1. chip with program1. EPROM chip should not be damaged. Because this chip needs ultraviolet light to remove the program, the program will not be damaged in the...
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